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JJAP Special Issue

"Advances in low-temperature bonding technologies for 3D integration"

Authors of papers that are accepted and presented in LTB-3D 2017 are kindly advised to consider submission of their original papers on the significant part of their work presented at the workshop to the Special Issue of Japanese Journal of Applied Physics (JJAP) entitled “Advances in low-temperature bonding technologies for 3D integration.” The URL for submission is

Japanese: https://xreview.jsap.jp/cgi-bin/submission/submission.cgi?si=129

The information for authors is placed at

Please get reminded that the "no-show no-publication" and "one-presentation one-submission" policies are applied. The respective authors of submitted manuscripts are advised to cite the codes of their presentations (session number) such as 16GO-01. The codes of presentations are shown on the conference program. The paper categories in the Spacial Issue are Regular Paper, Brief Note, and Progress Review. The authors of Regular Papers and Brief Notes are requested to cite their one-page conference abstracts and show the advantage in comparison with the abstracts. The deadline of submission is May 31, 2017. The Special Issue shall be published in Feb. 2018. The review process for the submitted manuscripts shall be managed by the editorial committee of the Special Issue. Note that the submitted manuscripts to the Special Issue shall be reviewed and edited based on the same standards applied for submissions to regular issues of JJAP.

On behalf of guest aditors, Chief Guest Editors: Prof. Tadatomo Suga (University of Tokyo)
Prof. Naoteru Shigekawa (Osaka City University)

Important date:

  • Submission deadline: May 31st,2017
  • Publication: February 2018