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LTB-3D Conference Committee

Steering Committee

T. SUGA, The University of Tokyo (Conference Chair)
T. SHIMATSU. Tohoku University(Conference vice Chair)
H. TAKAGI, AIST (Technical Program Chair )
N. TOYODA,Hyogo University (Technical Program Vice Chair )
E. HIGURASHI, The University of Tokyo (Publication Chair)
N. SHIGEKAWA, Osaka city University (Publication vice Chair)
H. ISHIDA, SUSS Micro Teck (Technical Program Vice Chair )
M. FUJINO, The University of Tokyo (Local Arrangement Chair)
N. KAWAMATA, The University of Tokyo (Conference Treasurer, Conference Secretary)

Advisory Committee

Y. TAIRA, Keio University(IEEE CPMT Society Japan Chapter Chair)
S. AOKI, Fujitsu Laboratories (IEEE CPMT Society Japan Chapter Vice Chair )
T. HATAKEYAMA, Toyama Prefectural University (IEEE CPMT Society Japan Chapter Secretary)
N. TANAKA, Hitachi Chemical Co., Ltd. (IEEE CPMT Society Japan Chapter Treasurer)
K. YOKOUCHI, Fujitsu Interconnect Tecknologies Ltd
M. AOYAGI, AIST (IEEE CPMT Society Japan Chapter Advisor)
Y. ANDO, Fujikura (IEEE CPMT Society Japan Chapter Advisor )
K. OTSUKA, Meisei University (IEEE CPMT Society Japan Chapter Advisor )
T. SUDO, Shibaura Institute (IEEE CPMT Society Japan Chapter Advisor )
Y. TAKAHASHI, Fuji Electric Co.,ltd (IMSI Representative Director )
T. ITOH, University of Tokyo (IMSI Director)

Local Organizing Committee
191st Committee on Innovative Interface Bonding Technology,
University-Industry Cooperative Research Committees, Japan Society for the Promotion of Science (JSPS)